Duraprime WB
Overview
Duraprime WB is a solvent-free, water-based two-pack epoxy adhesion promoter specifically designed for non-porous substrates. This eco-friendly, low-VOC primer provides excellent wetting properties on cementitious surfaces and delivers superior adhesion for subsequent epoxy and polyurethane flooring applications.
Features
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Solvent-free black conductive
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Two-pack low viscosity
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Eco-friendly low VOC
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Multi-substrate surface compatibility
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Controlled electrical resistance
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24-hour curing
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High resistance durability
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Easy brush application
Applications
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Non-porous substrate for DURAFLOOR SL
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Pre-treatment for DURAGIENE flooring materials
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Concrete surface primer for facilities
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Metal and wood substrate preparation
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Commercial flooring for manufacturing facilities
